Next-gen, PIC-based transceivers : design, test and validation

Photonic integrated circuits (PIC) are the technology currently deployed to tackle the bandwidth stress taking place in the transceiver industry. This stress is due to ever-increasing performance demands and costs pressures experienced by data centers and 5G applications. 

Transceiver vendors need to test and churn out thousands of transceivers per day. To save time during the manufacturing process, while guaranteeing quality, testing solutions must be both extremely fast and reliable. EXFO’s unique end-to-end transceiver testing solution enables the characterization of transceivers on the electrical-side, client-side and optical-side of manufactured units. 
This webcast reviews the current challenges and testing best-practices when designing, manufacturing and validating PIC-based transceivers from 25G to 400G. 

Key takeaways: 

• What are the current challenges of testing and validating PIC-based transceivers?
• What are the various compliance tests required for next-gen transceivers, from single components to packaged product?
•  What solutions does EXFO offer to optimize transceiver qualification?