Let your PIC shine: Advanced characterization for integrated photonics

Watch this webinar to discover how advanced characterization solutions lay the groundwork for breakthroughs in quantum computing, AI acceleration, and next-generation sensing—paving the way for national technological leadership.

In recent years, integrated photonics has revolutionized telecom transceivers, propelling data rates and energy efficiency to unprecedented heights. Now integrated photonics is poised to transform quantum photonics, sensing, and artificial intelligence—fields of vital importance to government research and R&D labs. These are exciting times that hold tremendous promise for technology innovators and early adopters.

However, testing photonic dies—though critical—remains very challenging when compared to characterizing electronic ICs. This is due to the fact that photonics is still in the early phases of development and design. Nonetheless, fabricating and integrating photonic circuits requires best-in-class characterization through a testing process that is accurate, repeatable, traceable, scalable, flexible and automated.

This webinar delves into the intricate world of photonic component characterization, exploring:

• Pitfalls faced by PIC engineers in government research and lab settings.
• State-of-the-art methods for evaluating photonic integrated circuits (PIC).
• Ways to future-proof CAPEX investments through flexible and scalable testing solutions.

Don’t miss out—watch now and gain exclusive insights from industry experts!

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For deeper insights, check out these related resources:

• Page : PIC testing
• Brochure: Optical testing solutions for universities and labs
• Video : Introducing Opal MD Probe station multi die testing
• Brochure: Passive component characterization